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Copper Liquid Cold Plate Heat Sinks Are Suitable For Central Processing Units (CPUs)
उत्पाद विवरण:
| उत्पत्ति के प्लेस: | Dongguan, Guangdong, चीन |
| ब्रांड नाम: | Uchi |
| प्रमाणन: | SMC |
| मॉडल संख्या: | तरल ठंडी प्लेट 01 |
भुगतान & नौवहन नियमों:
| न्यूनतम आदेश मात्रा: | 100 पीसी |
|---|---|
| मूल्य: | विनिमय योग्य |
| भुगतान शर्तें: | टी/टी, पेपैल, वेस्टर्न यूनियन, मनीग्राम |
| आपूर्ति की क्षमता: | प्रति माह 50000000pcs |
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विस्तार जानकारी |
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| गुस्सा: | T3 ~ T8 | सामग्री: | तांबे की सामग्री |
|---|---|---|---|
| मिश्र धातु या नहीं: | गैर मिश्र | सहनशीलता: | 0.05 मिमी |
| आकार: | वर्ग | प्रक्रिया: | ब्रेज़्ड स्किव्ड फिन |
| प्रमाणपत्र: | आईएसओ 9001:2000 आईएसओ 14001:2004 | ||
| प्रमुखता देना: | copper liquid cold plate heat sink,CPU liquid cooling plate,liquid cooling plate for CPUs |
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उत्पाद विवरण
Copper Liquid Cold Plate Heat Sinks for Central Processing Units (CPUs)
Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers, smartphones and Internet of Things (IoT) devices—serving as robust hard-core support for the steady operation and sustained growth of the digital economy.
Applications in High-end Manufacturing
Semiconductor and Chip Manufacturing
Advanced packaging technologies (e.g., 3D stacking) lead to heat accumulation inside chips, where the thermal conductivity of traditional materials has become a bottleneck.
AI Computing/Data Centers
With the surging heat flux density of chips, traditional cooling methods are struggling to meet demand, making thermal management an "invisible ceiling" that restricts computing power improvement.
Aerospace
The space environment features extreme temperatures and high vacuum, where convective heat dissipation is not feasible. Aerospace equipment is exposed to harsh temperature fluctuations.
Applications in Daily Life
- Digital Devices: Internal heat dissipation modules composed of metal cooling fins are fitted in computers, mobile phones, game consoles and other devices to ensure sustained performance.
- Communication Devices: To guarantee stability of high-speed data transmission and processing, these devices are usually equipped with large heat sinks.
- Household Appliances: Compressors and external unit condensers require efficient heat dissipation performance as they continuously transfer heat from indoor spaces to outdoors.
- Lighting Devices: Efficient heat dissipation design ensures luminous efficacy and long service life of LED lamp beads; energy conservation realization is inseparable from heat dissipation technology support.
- New Energy Vehicles: Sophisticated liquid cooling systems maintain optimal operating temperature in new energy vehicles.
Traditional Heat Dissipation Industry Challenges
- Traditional air-cooling technology cannot meet the 50W/cm²+ heat flux density demand of high-performance processors like AI chips
- Thermal conductive materials performance has hit a bottleneck, with conventional thermal greases difficult to exceed 5W/m*K thermal conductivity
- Liquid cooling technology delivers superior performance but features complex production processes and high technical requirements
Industry Transformation and Upgrading
The heat dissipation industry is undergoing strategic transformation from supporting industry to core technology sector with clearly defined upgrading path:
- Technology: Shifting from uniform heat dissipation to precision temperature control, with liquid cooling emerging as mainstream solution
- Industrial Positioning: Transforming from manufacturer to "heat dissipation as a service" solution provider
- Material Systems: Evolving toward high thermal conductivity and intelligence
- Manufacturing Paradigms: Deeply integrating digitalization and additive manufacturing
This transformation represents an identity revolution from auxiliary process to leading design, with heat dissipation capacity becoming a core indicator for measuring digital economy competitiveness.
Cold Plate Radiator Design
Custom internal flow channel design based on customer power consumption data and heat distribution patterns. Our engineering process includes comprehensive simulation analysis with iterative parameter adjustments to achieve optimal thermal and hydraulic performance targets.
Company Manufacturing Capabilities
Our mold workshop features comprehensive equipment including 22 electric discharge machines (EDM) of various types, including 2 MAKINO mirror EDM machines, 9 wire-cut EDM machines (3 Seibu and 1 Sodick imported from Japan), 7 spark erosion machines, 10 grinding machines, 2 milling machines and 1 lathe.
| Equipment Specification | Capability |
|---|---|
| Table Size | 500×350 mm |
| Rapid Traverse Speed | 5000 mm/min |
| Maximum Workpiece Weight | 500 kg |
| Maximum Electrode Weight | 50 kg |
High Machining Precision
Adopting SuperSpark4 and IES (Intelligent Expert System) technologies, we provide advanced adaptive power supply and jump control to stabilize EDM process and improve machining precision. Equipped with advanced ultra-surface and ultra-edge generator technologies, we achieve excellent surface finish and metallurgical quality.
Liquid Cooling System Technology
High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.
Liquid Cold Plate Varieties
- Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.
- Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.
- Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.
- Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.
Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment including:
- 1 Coordinate Measuring Machine
- 1 projector instrument
- 2 water high pressure testing machines
- 4 thermal resistance testing machines
- 2 liquid leakage testing machines
Customer Service Commitment
- Prompt response to all inquiries
- Competitive pricing with guaranteed quality
- Efficient production scheduling
- Optimal transportation solutions
- Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.
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